High-speed Chip Shooter
 | Placement head multi-nozzle laser head (6 nozzles) |
| Placement rate 16,000 cph laser centering (IPC 9850) | |
| Component range 01005 - 33.5 mm square components | |
| Component hight max. 12 mm | |
| Placement accuracy ±50 μm (3Sigma) | |
| Board dimension max. 410 x 360 mm | |
Laser sensor LNC60
The new LNC60 laser head is capable of on-the-fly centering of 6 components simultaneously. A variety of different nozzles can be attached at the same time, decreasing the nozzle change time. This sensor has the unique ability to center components from 01005 to 33.5 mm square parts. From ultra small, ultra thin, chip-shaped parts to small QFP, CSP, BGA,a wide range of components can be mounted at high-speed and with high accuracy.
