Deutsch      Englisch  
 
 

KE-2070

High-speed Chip Shooter



Placement head:
One multi-nozzle laser head (6 nozzles)
Placement rate:
16,000 CPH: chip (laser centering / IPC 9850)
Component range:
From 0402 (01005) to 33.5mm square components



 

Assembly Machines


FX-3     New!

KE-2060 light     New!
> limited edition

KE-2070 
KE-2080 

KE-2050R 
KE-2060R 

FX-1R       


Technical Information
 
New laser sensor: LNC60 (standard on KE-2080 as well)
The new LNC60 laser head is capable of on-the-fly centering of 6 components simultaneously. A variety of different nozzles can be attached at the same time, decreasing the nozzle change time. This sensor has the unique ability to center components from 0402 (01005) to 33.5 mm square parts. From ultra small, ultra thin, chip-shaped parts to small QFP, CSP, BGA,a wide range of components can be mounted at high-speed and with high accuracy.