KE-2055R

High-Speed Fine Pitch Assembler


Placement head:
Quadruple head with
multi-nozzle laser alignment and
multi-nozzle vision centering
(MNVC - optional)
Placement rate:
13,200 cph 
3,290 cph vision recognition
Component range:
01005 (0402 metric)
11 x 26.5mm or 20 x 20mm
Placement accuracy:
±50µm (3 Sigma)

 

Assembly Machines


KE-2050R 
KE-2055R 
KE-2060R 
FX-1R       
CX-1         

KE-2070  NEW
KE-2080  NEW

 

Higher throughput for fine-pitch components
Using the optional multi-nozzle vision centering (MNVC), fine-pitch components up to 20 x 20 mm can be measured and centered on the quadruple placement head. This almost doubles the placement rate for small fine-pitch components.
MNVC